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Newsletter Archive

October 2025: UHDI Via Walls

In this issue:

The right via structure depends on your Design goals, and Ultra HDI gives you new options.

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October 2025: The Top 5 Thermal PCB Applications

In this issue:

High-heat applications demand designs that manage thermal challenges without sacrificing performance. From LEDs to EV systems, thermal PCBs keep components reliable and efficient. Here are the top 5 applications where they make the biggest impact—plus key design considerations.

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From Aerospace to 5G—Ultra HDI Delivers

In this issue:

Are you working with 5G, radar, aerospace, or high-speed data links? These RF applications demand fidelity and miniaturization and Ultra HDI technology delivers. As the applications become more complex, the need for tighter design tolerances is clear.

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Sept. 2025: From Aerospace to 5G—Ultra HDI Delivers

In this issue:

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August 2025: Mastering Flex Stiffness

In this issue:

A complete guide to using flex stiffeners, a reinforcement layer applied to specific regions of a flexible circuit to add rigidity. While not part of the electrical circuit, stiffeners provide mechanical support, strengthening targeted areas without sacrificing overall flexibility.

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August 2025: Ultra HDI for Flex & Rigid-Flex

In this issue:

Ultra HDI is reshaping the landscape for flexible and rigid-flex PCB design. With line widths under 50 microns, microvias below 75 microns, and component pitches at 0.3 mm or tighter, these designs demand precision across the entire stack, everything from materials to manufacturing.

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July 2025: Thermal PCBs: Advanced Materials. Superior Heat Dissipation

In this issue:

Thermal PCBs are specially engineered to manage and dissipate heat generated by high-power electronic components. They're essential in applications where traditional FR4 PCBs would fail due to thermal stress, such as LED lighting, power electronics, and RF systems. Thermal PCBs are designed specifically to manage and dissipate heat generated by active components. They typically incorporate:

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July 2025: An Ounce of Prevention With Ultra HDI

In this issue:

Medical electronics demand miniaturization, reliability, and precision. For next-generation devices, Ultra High-Density Interconnect (UHDI) technology is a game-changer. Implantables, wearables, and diagnostic tools can be smaller, lighter, and smarter - without sacrificing signal integrity or performance.

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June 2025: From Concept to Production: Master the Art of Manufacturable PCB Design

In this issue:

A three-part DFM (Design for Manufacturability) guide series to walk you through every stage of the process.

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June 2025: June 2025: Designing Flex for Success

In this issue:

Explanation of the critical importance of the design phase in flex circuit manufacturing and introduces a three-tier product classification system.

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June 2025: Next-Gen Reliability Starts with UHDI

In this issue:

Are PCBs manufactured with Ultra HDI technology as reliable as those made with traditional methods?
Test your knowledge: UHDI quiz
UHDI Resources

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May 2025: Big News: We've Upgraded for Speed and Accuracy

In this issue:

Announcing ASC's latest production upgrade: the Pluritec X-CUT S1, as part of their commitment to staying current with evolving PCB technology.

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May 2025: Beyond the Trace: Mastering Soldermask in Ultra HDI Design

In this issue:

Soldermask challenges in Ultra HDI PCB designs, explaining that soldermask becomes a limiting factor at 25 μm spacing or less.

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April 2025: ASC’s Investment In Equipment Sets The Standard

In this issue:

Advanced CNC Machining for High-Performance PCBs leads to faster turnaround times, cost savings, better quality, and more!

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April 2025: Tired of Overheating? Discover MCPCB Solutions

In this issue:

As the demand for high-power electronics continues to grow, metal-backed printed circuit boards (PCBs) have become a go-to solution for industries requiring superior heat dissipation, structural integrity, and performance reliability.

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April 2025: Copper Filled Vias for UHDI

In this issue:

As PCB technology advances, Ultra HDI (Ultra High-Density Interconnect) designs are driving the demand for finer lines, denser layouts, and innovative via structures. One critical aspect of Ultra HDI design is the use of copper-filled vias, particularly in Via-In-Pad-Plated-Over (VIPPO) structures. Optimizing these features requires careful design considerations to ensure manufacturability, reliability, and performance.

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March 2025: Collaboration is Key to Designing Complex RF Antenna PCBs

In this issue:

We often urge “early and often” engagement between the pcb fabricator and the designer, whether they are an OEM, ODM or contracted design service. This rule of thumb is even more critical when working with complex RF antenna designs as the workflow to this technology has so many factors.

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March 2025: ASC’s R&D Solves PCB Challenges

In this issue:

At American Standard Circuits, we don’t just manufacture PCBs—we focus on engineering solutions. Our commitment to ongoing research and development ensures that even the most complex design challenges are met with innovation, precision, and reliability.

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March 2025: Pushing PCB Limits: Ultra HDI and the Future of Density

In this issue:

Traditional HDI technology is evolving. Historically, these designs have been limited to microvia sizes of around 4 mils, with capture pads typically 8–10 mils larger. Now, advancements in Ultra HDI technology are redefining these limits, enabling unprecedented density and performance capabilities

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February 2025: Revolutionizing SWaP with Ultra HDI Technology

In this issue:

Ultra HDI (UHDI) technology is transforming our approach to challenges in Space, Weight, and Power (SWaP). It is not just an innovation – it is a necessity for staying ahead of your competition. Here are just a few exciting examples of how Design and Fabrication experts are applying UHDI today.

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February 2025: Optimizing Flex PCBs: The Impact of Staggered vs. Stacked Conductors

In this issue:

Ever wondered what a flex coverlayer is and what it actually does? Are they a new innovation or have they been around for a while? Most importantly—why do they matter for your design?

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February 2025: RF PCB Layer Stackup

In this issue:

The term “pure build” refers to a multilayer PCB material construction that is composed of the same type of material throughout the stackup, such as a construction entirely of FR-4, PTFE, or another high-frequency material.

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January 2025: A $31,800 Success Story: Helping a Customer Save Big

In this issue:

Recently, ASC Global Sourcing partnered with a major OEM in the HVAC industry to deliver significant cost savings and exceptional results. This project was a test of our capabilities, as the OEM had always sourced domestically and doubted offshore suppliers would be interested in a low-volume, small part. We proved them wrong.

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January 2025: Thermal Benefits of MCPCBs

In this issue:

The thermal benefits of Metal Core Printed Circuit Boards (MCPCBs) are one of their most significant advantages, particularly in applications where heat management is critical. Here's a breakdown of these thermal benefits:

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January 2025: Exploring UHDI PCB Fabrication

In this issue:

Discover how Ultra HDI technology can help you unlock greater routing capabilities, optimize BGA breakout areas, and reduce costs.

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January 2025: Fundamentals of RF/Microwave Chapter 2

In this issue:

Discussion of copper foil

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In this issue:

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2024 Holiday Message from our CEO

In this issue:

. As we look to 2025, we’re excited to continue delivering the innovative PCB technology solutions you rely on to drive your success.

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December 2024: Exploring UHDI PCB Fabrication

In this issue:

UHDI is the future of RF. From improving performance to reducing size and cost, Ultra HDI is transforming design for high frequency applications.

Take our quiz and test your UHDI knowledge.

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November 2024: Unlock Global Savings Beyond China with ASC Global Sourcing

In this issue:

Examples of cost-effective, high-quality products sourced from regions beyond China

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November 2024: Expert Insights: Exploring Ultra HDI PCB Fabrication

In this issue:

Navigating Technology Choices: It All Depends On Your Desired Results
Current Projects in Progress at ASC
Test your UHDI knowledge

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October 2024: Fundamentals of RF/Microwave PCBs

In this issue:

Chapter 1 of our eBook, The Printed Circuit Designer's Guide To...Fundamewntals of RF/Microwave PCBs, Material Selection

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October 2024: Gain an Edge in Medical Device Design: Partnering Early with PCB Fabricators

In this issue:

ASC Sunstone Case Study: Innovative Medical Pill Camera Production with Flex/ Rigid-Flex PCB Introduction

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American Standard Circuits Advanced DFM Capabilities

In this issue:

DFM Process
DFM processes
Our capabilities

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August ASC Newsletter

In this issue:

Collaboration is Key for Mixed Use PCBs Whitepaper
77-second Wewbinar: The Kitchen Sink Board

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August 2024 Global Sourcing Newsletter

In this issue:

A quick guide to help you source the best products
Our gloibal sourcing capabilities

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The Advantages Of Embedded Passive Components

In this issue:

The Advantages Of Embedded Passive Components
77 second embedded passives video webinar
Free PCB resources

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July 2024 Global Sourcing Newsletter

In this issue:

Global sourcing strategy
Our capabilities

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Thermal LED PCB Applications

In this issue:

Thermal LED PCB Applications
77 second webinar
PCB Resources

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Ultra HDI Ask The Experts Series: Featuring Nava Shpaisman

In this issue:

Q & A with Nava Shpaisman, a senior research scientist with an in-depth understanding of the global advanced PCB and ICS markets and technology trends.

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