The term embedded passives refer to a printed circuit design and manufacturing technology in which passive components (such as resistors or capacitors) are integrated directly into the substrate, or the body, of a printed circuit board rather than being discrete components mounted on the surface. This technique is often employed in microelectronics and integrated circuits to reduce size, weight, and assembly costs while improving reliability and performance. By embedding passive components, manufacturers can create more compact and efficient electronic systems, especially in applications where space is limited or where high-frequency performance is critical.
Embedded Capacitance Material consists of a very thin layer of ceramic-filled epoxy sandwiched between two layers of copper foil. It can be patterned as a power and ground plane pair for a lower impedance, shared capacitance power distribution network. The biggest design benefit is that it increases the usable board area by allowing for the removal of many, if not all, capacitors equal to or below 0.1 Microfarad (μF) and their associated solder joints and vias.
Embedded resistors are planar resistive elements made into a thin film. This type of resistor becomes part of the etched and printed circuitry on the standard printed circuit board layer, and in assembly it eliminates the need for resistor solder joints. Embedded resistors are used over surface discrete resistors when there is a need to miniaturize a PCB foot-print, increase density, improve signal integrity or electrical performance, and increase reliability.

ASC works with the following materials on FR4 and high-performance laminates, including Rogers RO3000, 4000, and RT/duroid 6000 series, and flex polyimide
Resistance:
Quantic Ticer TCR®
Quantic Ticer TCR-EHF®
Quantic OhmegaPly®
(work with 10-1000 Ohm/square materials)
Capacitance:
We are able to pair these technologies with others in our HDI portfolio such as blind/buried/micro vias, cavities, and coins.