ASC manufactures Single-sided, Double-sided and Multilayer circuit boards with metal cladding for improved thermal management and grounding. We manufacture high frequency PCBs with metal heatsinks for the telecommunication and aerospace industries. The heat sinks and PCBs are typically connected thermally and electrically. The metal heat sinks help with thermal dissipation and grounding of circuits.
ASC uses commercially available pre-bonded and post-bonded materials. Pre-bonded laminates are typically supplied by Rogers or Taconic. Post-bonding is done via commercially available sheet film adhesive materials, ASC’s patented sheet film adhesives or sweat solder. Some of the applications are RF Power Amplifiers, Splitters & Combiners, Complex Filters and RF Power Distribution. Some of the suppliers of laminate / dielectric materials we utilize are: Isola, Nelco, Rogers & Taconic. Metals include Aluminum, Copper, and Brass Composites.
American Standard Circuits makes PCBs with unique aluminum composite materials to match the coefficient of thermal expansion (CTE) for various heat generating devices. These materials can match the CTE of ceramics, transistor packages and PCBs. This gives greater flexibility in designs to use lightweight materials and meet challenging environmental requirements.
John is ASC's Application Engineering Manager and is also a Process Engineering Specialist. He's been with ASC since 2011 and has nearly 20 years of experience in the industry.
John has a long history of being a problem solver for applications that require the superior thermal management and grounding capabilites that metal-backed PCBs can provide.
Lean manufacturing, Six Sigma and continuous process improvement are among John's varied interests in the field.
John talks with Dan Beaulieu at IPC 2015 about RF/Microwave