West Chicago-based PCB fabricator American Standard Circuits has recently incorporated the Ormet Paste Process to their capabilities, enabling next generation z-axis interconnects.
When making this announcement, President and CEO Anaya Vardya said, “We have known about this product for a while now and a year ago we decided to give it a try. So far we have been very impressed with what we can do with it. It does a good job when it comes to thick board layer constructions as well as mixed dielectrics. We have yet to explore all of the applications and look forward to learning more regarding what this process enables.”
The Ormet Paste Process has been around for some time but the industry is just now starting to catch up with the technology. The product can be used for several different applications, with ASC’s main focus being on using it to make Z-axis connections during lamination.
The product can be used to help with the following:
Thick boards - Layer Reduction:
High Speed Cap – Mixed Dielectric Builds:
“Any Layer” HDI Using Paste:
The Ormet Paste Is Different Because:
This also forms a metallurgical bond with metals it is in contact with. So, in some cases the paste can be used instead of plating.