Large computers and high-speed, high-clock-rate electronic devices generate large amounts of heat that must be efficiently dissipated for proper functioning of the device. Examples are: telecom systems, automotive, computer,power supply, military and motor control systems.
Instead of dissipating the heat via additional components such as cooling surfaces, we offer an elegant internal solution to the problem: we make the PCB itself thermally conductive. The heat from the components is dissipated via a heat-conductive bonding film onto the aluminum or copper layers below from where it is radiated. The heat is extracted through thermal vias, which are thermally and/or electrically connected to the metal layers.