Webinars

With this presentation, attendees will receive examples of how to solve many challenges associated with HDI, and other drilling constraints. Advanced methods to create a “Z-Axis” connection are being utilized in many applications. Transient Liquid Phase Sintering (TLPS) Materials, which is the use of copper sintering paste, i.e., Ormet® Paste Z-Interconnects instead of plating.

Attendees will receive understanding of how to solve the following challenges with drill & paste.


• Any Layer Via – no restricted usage, utilized on thin boards and package design.
• High Layer Count Boards - Unbuildable via hole aspect-ratio, used to join several sub-composites together, completely resolve high aspect ratio plating problems.
• Eliminates Controlled-depth Backdrilling requirement for high-speed signals, thus eliminating parasitic stubs, adding routing resources prohibited by backdrilling.
• HDI Boards (i.e., 4N4) 5 lamination cycles, 30-50 process steps per cycle, reduced to 2 cycles, significant fabrication process step reduction saves time and cost.
• Reduces Lamination Cycle Stress on material (Td) and via long term reliability.

Attendees will learn what it takes to successfully implement these concerns:

• Complex Solvability
• High-speed, RF and Thermal Performance
• Save Cost and Reduce Time while Improving Yield and Reliability

New A-SAP Process: The key to handling cutting edge PCB requirements for products of the future

ASC has licensed the Averatek’s A-SAP™ (Semi-Additive PCB Process). This process enables feature sizes of 25 micron and below, opening new possibilities and options for PCB designers to solve complex design issues. This session will provide an overview of the A-SAP™ process and explore Space, Weight and Packaging benefits including:

• Reduced circuit size
• Reduced layer count
• Reduced lamination cycles
• Reduced microvia layers
• Increased electronics functionality within existing footprint

Presenters: Mike Vinson, John Bushie, Anaya Vardya

Industry Experts Discuss New Cutting-Edge technology. This will take your PCBs to the next level!

Beginning with a recap of the Averatek A-SAP(TM) process, this session will explore:
• Signal Integrity Benefits: (high aspect ratio traces, tighter impedance control, etc.)
• Materials Characterization results: (range of standard, high performance and flex materials)
• Reliability Test Results: D-Coupon/ IST
• Ability to form conductors with Gold rather than Copper conductors

This webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials.

ASC is joining Taiyo to present thermal management materials. We'll discuss the electronics industry growing need for materials to handle extreme heat and our solution which includes high temperature resistant solder mask and heat dissipating products. We'll go over a brief history of solder mask as well as what is causing the need for thermal management and discuss solutions for solder mask and heat dissipating materials.

With this presentation, attendees will receive many examples of how to route a board with most all the concerns of todays 5G performance challenges. Dense HS-Digital and RF concerns, Signal Integrity improvements, Shielding and Isolation to reduce Emissions.

With this presentation, attendees will learn solutions to help avoid the most common failure points in today’s circuits. Bad data creates manufacturing failure points. Working with your supply chain learning from them how good data will process better. Learn where these failure points come from and what you can do to prevent them from occurring. This results in a board with high reliability and producibility, this approach is the key to product success.

Design For:

DFSolvability
DFPerformance
DFManufacturability
Today’s dense, high-speed circuits have competing requirements and all these perspectives must be considered as they play a part of the design, manufacturing, and performance of our end products. Failure can come in the following forms.

Not meeting aggressive product schedules
Technical performance, (SI) signal integrity and EMC concerns
Low manufacturing reliability and producibility which equates to cost drivers
This presentation will look at design, fabrication and assembly
Attendees will receive an understanding of how to implement pro-active solutions rather than re-active responses. The best way to beat a failure point is to preclude it.

We will discuss the cost impact of various design features that impact the cost of printed circuit boards.

Panasonic who has been the industry pioneer in the HSLL market segment with its Megtron 6 series product line. Recently Panasonic introduced the newest member of this family of products, Megtron7GN. Megtron 7GN has been developed for very low loss circuits that can be manufactured commercially for high layer PCB’s allowing for multiple lamination cycles while maintaining electrical, thermal and mechanical integrity. Megtron 7GN offers leading ultra-high-speed low loss HSLL performance with improved processing.

Flexible circuit growth globally is twice rigid and multilayer with dramatic growth planned for 5G applications and unique hybrid rigid flex design. The Panasonic Felios RF705S LCP flexible materials and R-BM-17 specialty low loss bond-plies have been developed to offer breakthrough performance for these segments. In the past manufacturing multilayer and rigid flex designs with LCP has been challenging to fabricators due to the difficult lamination cycles required to bond the layers together. The R-BM-17 low loss bond ply has significantly reduced this challenge with processing similar to legacy polyimide coverlay and bond-ply. In addition, the R-BM-17 material can also be used with Panasonic’s R-F775 polyimide flex materials to create a low cost HSLL flex circuit alternative.

This exciting webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials. Aismalibar produces a world class IMS (insulated metal substrate) product to assist engineers and designers in removing this excess heat. In addition, new IMS material, improves solder joint fatigue in PCB utilized in advanced system critical applications like LED automotive headlamps. Aismalibar has developed multiple specially designed products to not only dissipate excessive heat from PCB modules, but to also enable bendable LED tail light assembles. This webinar will cover the various laboratory test methods associated with quality control of IMPCB laminate materials, thermal conductive measurements as well as superior dielectric properties. As well as, long term reliability studies performed on their IMS materials. We will also discuss the various materials that Aismalibar produces to manufacture single sided, double sided and multi-layer IMPCB structures.

A step by step presentation of the fundamentals of printed circuit fabrication.

Topics in this webinar include:

<ul>
<li>How is a multi-layer printed circuit board manufactured?</li>
<li>What are some of the design aspects you should consider when designing your PCB?</li>
<li>How can your PCB design impact cost?</li>
</ul>

Flex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.

* What are the benefits of Flex circuits?
* What are the different types of flex circuits?
* What are the different flex material options and selection criteria?
* What are some of the unique DFM considerations for flex / rigid-flex PCB?
* What things need to be considered while designing cost effective flex circuits?
* How have changes in designs impacted cost / manufacturing and reliability?

PCB surface finishes are critical for assembly process and impact the functionality of the application. We will describe the various surface finish options available for printed circuit boards.

* What is the purpose of the PCBs surface finish? Why does it matter?
* What are the different surface finish options available?
* What criteria should we use in selecting a surface finish?
* What are the pro's & con's of the various surface finishes available?
* What are new and emerging surface finishes I should know about?

Many PCB's require controlled impedance circuits. This webinar represents a complete overview of this requirement.

* What are the implications of controlled impedance to the PCB manufacturing process?
* What are the various structures?
* How can you work with your PCB fabricator during the design process to minimize cost impacts?
* What are the implications of controlled impedance on Signal Integrity?

We will discuss best practices for PCB Fabrication notes and their importance.

* How do Fab notes fit in the quote process?
* What are the minimum requirements for data supplied?
* What are the common issues with the data itself?

We will discuss best practices for documentation of Flex and Rigid-Flex PCB's as well as what mistakes to avoid.

* What are best practices for documentation of Flex and Rigid-Flex PCB's?
* What are the common mistakes to be avoided?

This webinar focuses on the critical industry need for heat dissipation through PCB laminate materials.

* How does Ventec IMS assist in removing waste heat?
* How does Ventec products help promote strong solder joint integrity?"

This webinar will focus on various IMPCB or MCPCB applications, plus Metal core technologies

* What are the different IMPCB or MCPCB applications?
* What technologies are used?
* What are the critical design parameters and processes?
* What Metal core technologies are available?
* What are their critical design parameters?
* What material options are available for metal core?"

We discuss the manufacturing process for copper foil

* What are the different kinds of copper foil available?
* What are the pro’s and con’s of the various foils?
* What are the implications from a design perspective?
* When should advanced copper foil offering such as MicroThin be utilized?

An understanding of pattern plating will help RF Microwave PCB designers

* What are the IPC requirements for plating and pattern plating?
* What implications do these requirements imply from a design perspective.
* What implications does this have for thick copper plating?

We will have guest speakers from DuPont and Oak-Mitsui

* How can you use Embedded Capacitance materials?
* How can you solve the challenges of Power Delivery?

We will discuss the various high frequency material offerings from Rogers Corporation.

We will discuss the various high frequency material offerings from Isola Corporation.

An overview of Via Fill

* What Via Fill options are available?
* What are the pros and cons of the different available options?
* What are the design cost implications?

We will discuss the various high frequency material offerings from AGC-Nelco.

A step by step presentation of the fundamentals of printed circuit fabrication.

Topics in this webinar include:

<ul>
<li>How is a multi-layer printed circuit board manufactured?</li>
<li>What are some of the design aspects you should consider when designing your PCB?</li>
<li>How can your PCB design impact cost?</li>
</ul>

Flex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.

* What are the benefits of Flex circuits?
* What are the different types of flex circuits?
* What are the different flex material options and selection criteria?
* What are some of the unique DFM considerations for flex / rigid-flex PCB?
* What things need to be considered while designing cost effective flex circuits?
* How have changes in designs impacted cost / manufacturing and reliability?

We will discuss best practices for PCB Fabrication notes and their importance.

* How do Fab notes fit in the quote process?
* What are the minimum requirements for data supplied?
* What are the common issues with the data itself?