Webinars

We're inviting you to join our free Webinar Wednesdays!

American Standard Circuits is announcing our new Webinar Wednesday series. We will be hosting free Webinars every Wednesday, each week focusing on a specific PCB topic. Our experts will be there to answer any questions you may have!


IMPCB / MCPCB

September 23 @ 11:00 am (CDT)

This webinar will focus on various IMPCB or MCPCB applications, different technologies, critical design parameters and processes. We will also discuss Metal core technologies and critical design parameters, as well as some of the material options available.

Register

IMPCB Materials- Ventec

September 30 @ 11:00 am (CDT)

This webinar will focus on the critical industry need for heat dissipation through PCB laminate materials. Today’s electronic modules and components are getting smaller in size yet producing greater power output, thus generating significant excess heat that has to be moved to an additional source- heatsink or chassis. Ventec has a world class IMS (insulated metal substrate) product offering to assist engineers and designers in removing this waste heat. In addition, solder joint fatigue is a critical concern for designers as IMS finds a home in system critical applications like headlamps. Ventec has developed multiple products to not only dissipate heat from modules, but also promote strong solder joint integrity. A full overview of these products used in single layer and multiple layer applications will be shared during this webinar, followed by a technical Q & A. Please join us to learn more about Ventec's thermal management offerings!

Register

IMPCB Materials- Aismalibar

October 7 @ 11:00 am (CDT)

This exciting webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials. Today’s electronic modules and components are progressively getting considerably smaller in size yet are producing greater power outputs. Consequently, the PCB is generating significant excess heat that has to be efficiently transferred then dissipated by a heatsink. Aismalibar produces a world class IMS (insulated metal substrate) product to assist engineers and designers in removing this excess heat. In addition, new IMS material, improves solder joint fatigue in PCB utilized in advanced system critical applications like LED automotive headlamps. Aismalibar has developed multiple specially designed products to not only dissipate excessive heat from PCB modules, but to also enable bendable LED tail light assembles. This webinar will cover the various laboratory test methods associated with quality control of IMPCB laminate materials, thermal conductive measurements as well as superior dielectric properties. As well as, long term reliability studies performed on their IMS materials. We will also discuss the various materials that Aismalibar produces to manufacture single sided, double sided and multi-layer IMPCB structures.

An extensive full overview of their products from single layer through to multiple layer applications as well as advanced bend to fit products will be discussed during this webinar, followed by a technical question period. Please join us to learn more about Aismalibar thermal management printed circuit laminates.

Register

RF Microwave Thermal Mangement

October 14 @ 11:00 am (CDT)

This webinar will focus on the critical industry need for heat dissipation through PCB laminate materials. Today’s electronic modules and components are getting smaller in size yet producing greater power output, thus generating significant excess heat that has to be moved to an additional source- heatsink or chassis. Ventec has a world class IMS (insulated metal substrate) product offering to assist engineers and designers in removing this waste heat. In addition, solder joint fatigue is a critical concern for designers as IMS finds a home in system critical applications like headlamps. Ventec has developed multiple products to not only dissipate heat from modules, but also promote strong solder joint integrity. A full overview of these products used in single layer and multiple layer applications will be shared during this webinar, followed by a technical Q & A. Please join us to learn more about Ventec's thermal management offerings!

Register

Archived Webinars


Copper Foil
September 16, 2020

Watch

RF Materials- AGC (Taconic)
September 2, 2020

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Via Fill
August 26, 2020

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RF Materials- Isola
August 19, 2020

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RF Materials-Rogers
August 12, 2020

Watch


Embedded Capacitance
August 5, 2020

Watch


Understanding Pattern Plating
July 29, 2020

Watch


PCB Documentation for Flex
July 22, 2020

Watch


PCB Fab Notes
July 15, 2020

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Controlled Impedance PCB Fab to SI
July 1, 2020

Watch


Surface Finishes | June 24, 2020

Watch


Flex/Rigid Flex | June 17, 2020

Watch


PCB 101 | June 10, 2020

Watch