American Standard Circuits presents two webinars each month, focusing on different topics of interest to PCB designers. ASC's experts are often joined by industry experts who are there to answer any questions you may have.
Topics
- Materials (6)
- RF/Microwave (10)
- IMPCB/MCPCB (1)
- Flex/Rigid Flex (6)
- Thermal Management (5)
- Fundamentals (6)
- Specialty (2)
- Most Watched (4)
- Embedded Passives (2)
Upcoming Webinars
Archived Webinars
Z-Axis Interconnects: Game Changing Innovations
Advanced methods to create a “Z-Axis” connection are being utilized in many applications. Transient Liquid Phase Sintering (TLPS) Materials, which is the use of copper sintering paste, i.e., Ormet® Paste Z-Interconnects instead of plating.
Z-Axis Interconnects: Game Changing Innovations
Attendees will receive understanding of how to solve the following challenges with drill & paste.
• Any Layer Via – no restricted usage, utilized on thin boards and package design.
• High Layer Count Boards - Unbuildable via hole aspect-ratio, used to join several sub-composites together, completely resolve high aspect ratio plating problems.
• Eliminates Controlled-depth Backdrilling requirement for high-speed signals, thus eliminating parasitic stubs, adding routing resources prohibited by backdrilling.
• HDI Boards (i.e., 4N4) 5 lamination cycles, 30-50 process steps per cycle, reduced to 2 cycles, significant fabrication process step reduction saves time and cost.
• Reduces Lamination Cycle Stress on material (Td) and via long term reliability.
Attendees will learn what it takes to successfully implement these concerns:
• Complex Solvability
• High-speed, RF and Thermal Performance
• Save Cost and Reduce Time while Improving Yield and Reliability
Next Gen Line/Space Capability for PCB Designs (Pt 1)
Averatek’s A-SAP™ (Semi-Additive PCB Process) enables feature sizes of 25 micron and below, opening new possibilities and options for PCB designers to solve complex design issues.
Next Gen Line/Space Capability for PCB Designs (Pt 1)
ASC has licensed the Averatek’s A-SAP™ (Semi-Additive PCB Process). This process enables feature sizes of 25 micron and below, opening new possibilities and options for PCB designers to solve complex design issues. This session will provide an overview of the A-SAP™ process and explore Space, Weight and Packaging benefits including:
• Reduced circuit size
• Reduced layer count
• Reduced lamination cycles
• Reduced microvia layers
• Increased electronics functionality within existing footprint
Presenters: Mike Vinson, John Bushie, Anaya Vardya
Next Gen Line/Space Capability for PCB Designs (Pt 2)
Industry Experts Discuss New Cutting-Edge technology. This will take your PCBs to the next level!
Next Gen Line/Space Capability for PCB Designs (Pt 2)
Beginning with a recap of the Averatek A-SAP(TM) process, this session will explore:
• Signal Integrity Benefits: (high aspect ratio traces, tighter impedance control, etc.)
• Materials Characterization results: (range of standard, high performance and flex materials)
• Reliability Test Results: D-Coupon/ IST
• Ability to form conductors with Gold rather than Copper conductors
Aismalibar Thermal Management Materials
This webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials.
Aismalibar Thermal Management Materials
Taiyo's Solution for Thermal Management
We'll discuss the electronics industry's growing need for materials to handle extreme heat and our solution which includes high temperature resistant solder mask and heat dissipating products.
Taiyo's Solution for Thermal Management
Placement & Routing High Speed Boards by Insulectro
58 minutesAttendees will receive many examples of how to route a board with most all the concerns of today's 5G performance challenges. Dense HS-Digital and RF concerns, signal Integrity improvements, Shielding and Isolation to reduce Emissions.
Placement & Routing High Speed Boards by Insulectro
Avoiding the Most Common PCB Failure Modes by Insulectro
62 MinutesAttendees will learn solutions to help avoid the most common failure points in today’s circuits. Bad data creates manufacturing failure points. Working with your supply chain learning from them how good data will process better.
Avoiding the Most Common PCB Failure Modes by Insulectro
Design For:
DFSolvability
DFPerformance
DFManufacturability
Today’s dense, high-speed circuits have competing requirements and all these perspectives must be considered as they play a part of the design, manufacturing, and performance of our end products. Failure can come in the following forms.
Not meeting aggressive product schedules
Technical performance, (SI) signal integrity and EMC concerns
Low manufacturing reliability and producibility which equates to cost drivers
This presentation will look at design, fabrication and assembly
Attendees will receive an understanding of how to implement pro-active solutions rather than re-active responses. The best way to beat a failure point is to preclude it.
Impact of Design Features on PCB Cost
We will discuss the cost impact of various design features that impact the cost of printed circuit boards.
Impact of Design Features on PCB Cost
Panasonic Advanced Materials for High Speed, HDI and Flexible Printed Circuits
49 minutesThis webinar will review the newest member of Panasonic’s Megtron family of products, Megtron 7GN and the Felios R-F705S family of low loss adhesiveless flexible circuit materials.
Panasonic Advanced Materials for High Speed, HDI and Flexible Printed Circuits
Flexible circuit growth globally is twice rigid and multilayer with dramatic growth planned for 5G applications and unique hybrid rigid flex design. The Panasonic Felios RF705S LCP flexible materials and R-BM-17 specialty low loss bond-plies have been developed to offer breakthrough performance for these segments. In the past manufacturing multilayer and rigid flex designs with LCP has been challenging to fabricators due to the difficult lamination cycles required to bond the layers together. The R-BM-17 low loss bond ply has significantly reduced this challenge with processing similar to legacy polyimide coverlay and bond-ply. In addition, the R-BM-17 material can also be used with Panasonic’s R-F775 polyimide flex materials to create a low cost HSLL flex circuit alternative.
IMPCB -- Aismalibar
64 minutesThis exciting webinar will cover a new important industry requirement for heat dissipation in advanced circuit design utilizing highly conductive thermal PCB laminate materials.
IMPCB -- Aismalibar
PCB 101
Topics in this webinar include:
-How is a multi-layer printed circuit board manufactured?
-What are some of the design aspects you should consider when designing your PCB?
-How can your PCB design impact cost?
Flex/Rigid Flex: Materials, DFM and Cost Impacts
54 minutesFlex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.
Flex/Rigid Flex: Materials, DFM and Cost Impacts
* What are the benefits of Flex circuits?
* What are the different types of flex circuits?
* What are the different flex material options and selection criteria?
* What are some of the unique DFM considerations for flex / rigid-flex PCB?
* What things need to be considered while designing cost effective flex circuits?
* How have changes in designs impacted cost / manufacturing and reliability?
Surface Finishes
61 minutesPCB surface finishes are critical for assembly process and impact the functionality of the application. We will describe the various surface finish options available for printed circuit boards.
Surface Finishes
* What is the purpose of the PCBs surface finish? Why does it matter?
* What are the different surface finish options available?
* What criteria should we use in selecting a surface finish?
* What are the pro's & con's of the various surface finishes available?
* What are new and emerging surface finishes I should know about?
Controlled Impedance- PCB Fabrication to Signal Integrity
60 minutes
Many PCB's require controlled impedance circuits. This webinar represents a complete overview of this requirement.
Controlled Impedance- PCB Fabrication to Signal Integrity
* What are the implications of controlled impedance to the PCB manufacturing process?
* What are the various structures?
* How can you work with your PCB fabricator during the design process to minimize cost impacts?
* What are the implications of controlled impedance on Signal Integrity?
PCB Fab Notes
57 minutes
We will discuss best practices for PCB Fabrication notes and their importance.
PCB Fab Notes
* How do Fab notes fit in the quote process?
* What are the minimum requirements for data supplied?
* What are the common issues with the data itself?
Documentation for Flex and Rigid Flex
45 minutes
We will discuss best practices for documentation of Flex and Rigid-Flex PCB's as well as what mistakes to avoid.
* What are best practices for documentation of Flex and Rigid-Flex PCB's?
* What are the common mistakes to be avoided?
Documentation for Flex and Rigid Flex
* What are best practices for documentation of Flex and Rigid-Flex PCB's?
* What are the common mistakes to be avoided?
IMPCB - Ventec
64 minutesThis webinar focuses on the critical industry need for heat dissipation through PCB laminate materials.
IMPCB - Ventec
* How does Ventec IMS assist in removing waste heat?
* How does Ventec products help promote strong solder joint integrity?"
IMPCB/MCPCB
35 minutesThis webinar will focus on various IMPCB or MCPCB applications, plus Metal core technologies
IMPCB/MCPCB
* What are the different IMPCB or MCPCB applications?
* What technologies are used?
* What are the critical design parameters and processes?
* What Metal core technologies are available?
* What are their critical design parameters?
* What material options are available for metal core?"
Copper Foil
* What are the different kinds of copper foil available?
* What are the pro’s and con’s of the various foils?
* What are the implications from a design perspective?
* When should advanced copper foil offering such as MicroThin be utilized?
Understanding Pattern Plating
60 minutesAn understanding of pattern plating will help RF Microwave PCB designers.
Understanding Pattern Plating
* What are the IPC requirements for plating and pattern plating?
* What implications do these requirements imply from a design perspective.
* What implications does this have for thick copper plating?
Embedded Capacitance
* How can you use Embedded Capacitance materials?
* How can you solve the challenges of Power Delivery?
RF Materials- Rogers
67 minutesWe will discuss the various high frequency material offerings from Rogers Corporation.
RF Materials- Rogers
RF Materials- Isola
52 minutesWe will discuss the various high frequency material offerings from Isola Corporation.
RF Materials- Isola
Via Fill
* What Via Fill options are available?
* What are the pros and cons of the different available options?
* What are the design cost implications?
RF Materials- AGC Nelco
54 minutesWe will discuss the various high frequency material offerings from AGC-Nelco.
RF Materials- AGC Nelco
Rogers- Adhesive and Bonding Material Options for High Frequency PCBs
The focus of this presentation will be on the adhesive and bonding material options for high frequency printed circuit designs. We will examine the electrical, mechanical, and thermal performance parameters which all need to be factored into final adhesive choice.
Rogers- Adhesive and Bonding Material Options for High Frequency PCBs
Design Guidelines associated with Unique RF Features
This webinar will discuss various design considerations associated with RF applications including cavities, edge plating, structural recesses and heat sinks.
Design Guidelines associated with Unique RF Features
PCB Designers Toolbox: PCB Mfg process and implications to design
In this interactive webinar we discuss the PCB Fabrication process.
PCB Designers Toolbox: PCB Mfg process and implications to design
Some of you questions that we will answer:
-How is a multi-layer printed circuit board manufactured?
-What are some of the design aspects you should consider when designing your PCB?
-What are some things to consider while designing the PCB that can help reduce the cost.
OhmegaPly® & Ticer TCR®: The Performance and Reliability Benefits of Thin-Film Resistive Foil
Overview on thin-film resistive foil technology, a critical tool in solving today’s complex PCB design challenges.
OhmegaPly® & Ticer TCR®: The Performance and Reliability Benefits of Thin-Film Resistive Foil
PCB Designers Toolbox: Fundamentals of Flex and Rigid-Flex
Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.
PCB Designers Toolbox: Fundamentals of Flex and Rigid-Flex
Some of the topics we will cover in this interactive:
* Benefits of Flex circuits
* Different types of flex circuits
* Flex material options and selection criteria
* Unique DFM considerations for flex / rigid-flex PCB
* Designing cost effective flex / rigid-flex circuits
* Impact of changes in designs on cost, manufacturing and reliability
PCB Designers Toolbox: Best Practices for Fabrication Notes
We will cover the importance of fab notes in the quote process, best practices for Flex and RF, and more.
PCB Designers Toolbox: Best Practices for Fabrication Notes
* The importance of fabrication notes in the quote process and manufacturing of PCB's
* Best practices for rigid, flex and rigid-flex fab notes
* A check list for fab notes
PCB Designers Toolbox: Documentation for Flex and Rigid-Flex Circuit Boards
We will discuss best practices for documentation of Flex and Rigid-Flex PCBs as well as what mistakes to avoid.
PCB Designers Toolbox: Documentation for Flex and Rigid-Flex Circuit Boards
* What are best practices for documentation of Flex and Rigid-Flex PCBs?
* What are the common mistakes to be avoided?
PCB Designers Toolbox: Documentation and DFM Guidelines for PCB Assembly
We will discuss the requirements to establish good documentation for your PCB assembly, good kitting practices for components if you intend to provide components to your assembler and some important DFM guidelines.
PCB Designers Toolbox: Documentation and DFM Guidelines for PCB Assembly
Special PCB Processes for Medical Electronics
ASC highlights the best PCB fabrication technologies for the most reliable and critical medical electronics products.
Special PCB Processes for Medical Electronics
From the Averatek A-SAP process to other very reliable processes this webinar will offer the best solutions for your Medical Electronics products. Case studies will be included.
PCB Designers Toolbox: Rigid-flex Design Practices
Laura Martin, Director of Technology, Insulectro dives into some critical IPC rigid-flex design specifications that impact reliability, manufacturability, and cost.
PCB Designers Toolbox: Rigid-flex Design Practices
Most Viewed Webinars
PCB 101
Topics in this webinar include:
-How is a multi-layer printed circuit board manufactured?
-What are some of the design aspects you should consider when designing your PCB?
-How can your PCB design impact cost?
Flex/Rigid Flex: Materials, DFM and Cost Impacts
54 minutesFlex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design this webinar will give you a different perspective.
Flex/Rigid Flex: Materials, DFM and Cost Impacts
* What are the benefits of Flex circuits?
* What are the different types of flex circuits?
* What are the different flex material options and selection criteria?
* What are some of the unique DFM considerations for flex / rigid-flex PCB?
* What things need to be considered while designing cost effective flex circuits?
* How have changes in designs impacted cost / manufacturing and reliability?
PCB Fab Notes
57 minutes
We will discuss best practices for PCB Fabrication notes and their importance.
PCB Fab Notes
* How do Fab notes fit in the quote process?
* What are the minimum requirements for data supplied?
* What are the common issues with the data itself?