RF/Microwave
ASC has extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuits. We work closely with our worldwide customers to deliver prototype-to-high volume manufacturing of RF circuits.
Some of the suppliers of laminate / dielectric materials we utilize are: Isola, Nelco, Rogers & Taconic. In addition, we manufacture high frequency PCBs with metal heat sinks for the telecommunication and aerospace industries. The heat sinks and PCBs are typically connected thermally and electrically. The metal heat sinks help with thermal dissipation and grounding of circuits. ASC uses commercially available pre-bonded and post-bonded materials. Pre-bonded laminates are typically supplied by Rogers or Taconic. Post-bonding is done via commercially available sheet film adhesive materials, ASC’s patented sheet film adhesives or sweat solder.
- Single, Double Sided, Multilayer and Hybrid Multilayers
- Blind & Buried Vias
- Conductive & Non Conductive Via Fill
- Castellations
- Wire bondable surface finishes
- Laser cut vias and routing
- Pre-bonded and post-bonded metal backed circuit boards
- Plated through-hole capability metal carrier to PTFE
- Aluminum Composites: American Standard Circuits makes PCBs with unique aluminum composite materials to match the coefficient of thermal expansion (CTE) for various heat generating devices. These materials can match the CTE of ceramics, transistor packages and PCBs. This gives greater flexibility in designs to use lightweight materials and meet challenging environmental requirements.
- Pre-bonded and post-bonded materials
- Thermally and electrically conductive and non-conductive proprietary adhesive bonded laminates
- Plated through-hole capability metal carrier to PTFE
- In-house plating and precision machining for finished assemblies
- Pre-bonded and post-bonded materials
- Thermally and electrically conductive and non-conductive proprietary and commercially available adhesive bonded laminates
- Plated through-hole capability metal carrier to PTFE
- Single, Double Sided & Multilayer
- Precision pocket machining
- Heat Sink Technology
- Any type of wire bondable finishes
- In-house plating and precision machining for finished assemblies
- Pre-bonded to Post-bonded assembly conversion
- Discrete PCB to Pre-bond or Post-bond assembly conversion
Your expert for RF/Microwave PCBs is John Bushie
John is ASC's Application Engineering Manager and is also a Process Engineering Specialist. He's been with ASC since 2011 and has nearly 20 years of experience in the industry.
John has a long history of being a problem solver for applications that require the superior thermal management and grounding capabilites that metal-backed PCBs can provide.
Lean manufacturing, Six Sigma and continuous process improvement are among John's varied interests in the field.
John talks with Dan Beaulieu at IPC 2015 about RF/Microwave