RF Microwave

ASC proudly offers advanced RF microwave PCBs that use high frequency and heat sink technologies. We have extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuits. We work closely with our worldwide customers to deliver prototype-to-high volume manufacturing of RF microwave PCBs.

 Some of the suppliers of laminate / dielectric materials we utilize are:  Nelco, Rogers, Isola, & Taconic. We  manufacture high frequency PCBs with metal heat sinks for the telecommunication and aerospace industries. The heat sinks and RF Microwave PCBs are typically connected thermally and electrically. The metal heat sinks help with thermal dissipation and grounding of circuits. ASC uses commercially available pre-bonded and post-bonded materials for our RF microwave PCBs. Pre-bonded laminates are typically supplied by Rogers, Isola, or Taconic. Post-bonding is done via commercially available sheet film adhesive materials, ASC’s patented sheet film adhesives or sweat solder.

Your expert for RF/Microwave PCBs is John Johnson

RF Circuitry

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: ASC has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

Metal Backed PTFE circuits using:
• Aluminum Composites:
American Standard Circuits makes PCBs with unique aluminum composite materials to match the coefficient of thermal expansion (CTE) for various heat generating devices. These materials can match the CTE of ceramics, transistor packages and PCBs. This gives greater flexibility in designs to use lightweight materials and meet challenging environmental requirements.
• Pre-bonded and post-bonded materials 
• Thermally and electrically conductive and non-conductive proprietary adhesive bonded laminates 
• Plated through hole capability metal carrier to PTFE 
• In-house plating and precision machining for finished assemblies 
• Single -, Double Sided & Multilayer PTFE PCB’s 
• Precision pocket machining 
• High tolerance capabilities 
• Thin dielectric films 
• Any type of wire bondable finishes

John has a long tenure in Material and Printed Circuit manufacturing.  After obtaining an Masters of Science in Organic Chemistry from The Ohio State University, he has held positions as an R&D Chemist, Quality Engineer, Sr. Process Engineer, Quality Manager, Sales Rep, Director of Sales, General Manager, President/CEO.  Prior to joining ASC as a Director of Business Development, he was VP of Sales and Customer Support at Averatek Corp and focused on Ultra Fine Line technology.

John is currently serves as ASC’s Director of Quality and is ASC’s Technology Expert on Ultra High Density Interconnects.

John has a long tenure in Material and Printed Circuit manufacturing.  After obtaining an Masters of Science in Organic Chemistry from The Ohio State University, he has held positions as an R&D Chemist, Quality Engineer, Sr. Process Engineer, Quality Manager, Sales Rep, Director of Sales, General Manager, President/CEO.  Prior to joining ASC as a Director of Business Development, he was VP of Sales and Customer Support at Averatek Corp and focused on Ultra Fine Line technology.

John is currently serves as ASC’s Director of Quality and is ASC’s Technology Expert on Ultra High Density Interconnects and RF/Microwave.