E-NEWSLETTER l JUNE 2021
A MESSAGE FROM OUR CEO
American Standard Circuits now offers Averatek’s A-Sap Process!

In these exciting changing times for our industry, we continue to strive to provide our customers with cutting-edge high-tech solutions.

The Averatek A-Sap process is the latest, and might I add, most exciting of these solutions. A-Sap is a very high-density manufacturing process for circuit boards with metal traces as narrow as 15 microns.

The need for increasingly complex electronics, combined with the obsolescence of larger component packages, is driving innovation to provide alternatives to the traditional subtractive-etch fabrication process that will provide circuit layers reliably, and repeatedly, with sizes of 25 micron or finer. The A-Sap process provides the right solution to meet this challenge.

American Standard is proud to provide this special technology as one of the first PCB fabricators in the industry to become a licensed user of Averatek’s A-Sap process. Read on to learn more.
As always, we thank you for your business.


Sincerely,

Anaya Vardya
President and CEO
American Standard Circuits
A-SAP

American Standard Circuits has partnered with Averatek on their A-SAPTM technology (Averatek-Semi Additive Process). This additive process (as opposed to the current subtractive process) allows PCB manufacturing with line width and space down to 15 microns (0.6 mils). Some of the benefits of using A-SAPTM are:

·        Significant size & weight reduction
·        Improved reliability & signal integrity
·        Improved RF performance
·        Reduced costs
·        Biocompatibility
Printed Circuit Manufacturing costs are reduced by reducing the PCB footprint size, number of layers and number of lamination cycles. The key chemical component of the process is LMITM (Liquid Metal Ink), which produces a thin, uniform, and dense electroless deposition. Features of LMITM deposit include:
·        Ultra thin: a few nanometers thick
·        Ultra dense: fully-packed atomic film
·        Conforms to any 3D surface at a nanometer scale
·        Non-Aqueous: enables low-cost manufacturing
·        Works for many different pure metals and alloys of those metals: copper, gold, silver, palladium, platinum, etc.
Check out our new YouTube series, Bleeding Edge, where our experts break down the latest and greatest technology in the PCB world!
This episode features John Bushie breaking down A-SAP.
UPCOMING WEBINARS
Design Guidelines associated with Unique RF Features
June 23, 2021
11:00 am to 12:00 pm (CDT)

Many RF boards have cavities and/or edge plating. Cavity PCB’s have structural recesses to enable additional functionality and can be seen in a number of different RF applications. These types of features allow insertions of heat sinks. The inner cavity surface can also be used for electrical contact, normally a ground connection. Edge plating may be required to improve EMI shielding and/or improve chasis ground in electronic systems. This webinar will discuss various design considerations associated with these specific features.
ON DEMAND A-SAP WEBINARS!
OUR BOOKS ARE DOING GREAT!
FLEX AND RIGID-FLEX FUNDAMENTALS                                                        4,573 DOWNLOADS       
FUNDAMENTALS OF RF/MICROWAVE PCBS                                                 3,964 DOWDLOADS
PCB FUNDAMENTALS                                                                                       3,257 DOWNLOADS
THERMAL MANAGEMENT A FABRICATOR’S PERSPECTIVE                      1,653 DOWNLOADS
Our Experts are one reason why American Standard Circuits is North America's leading independent PCB fabricator. Our entire experienced and professional staff is ready and able to make your next PCB project easy!