With the use of Uyemura’s Thru-Cup EVF-R plating chemistry, ASC has added acid copper plating filled blind vias to their product capabilities. Copper filled vias lend themselves to stacked via technology, achieved using laser formed or mechanically drilled vias. Traditionally a staple in consumer products, ASC is seeing increased demand in this technology for high reliability applications. The ability to fill between 0.0039-0.010” vias at aspect ratios up to 1:1 greatly expands ASC’s capabilities in that market space and further meeting the reliability demands.
American Standard Circuits’ President and CEO Anaya Vardya stated, “We have been producing boards with epoxy filled vias for many years now and that has become pretty standard technology. In the past 24 months we have seen an increasing demand for copper filled vias, so much so that we knew we needed to provide this technology as well. Adding copper filled blind vias puts us in a great position to meet even more customer needs as the demand increases.”