American Standard Circuits is now offering fusion bonding of PTFE-based materials. PTFE material fusion bonding uses high temperature (≥700°F/371°C) to bond PTFE directly to the copper circuitry and surrounding PTFE. This achieves bonding of the core materials without the use of a separate bonding agent acting as a bond ply or pre-preg.
With fusion bonding, you achieve an entirely isotropic package for stripline circuitry. This may be done utilizing either a PTFE core with copper removed or with a special uncompressed PTFE ply which acts as a filler/bond ply but consists of the same base material as the rest of the PTFE cores within the package. It is this uniformity and the reduction or elimination of DK variation within the package that allows the unparalleled performance and design accuracy.
When discussing the introduction of fusion bonding, President and CEO Anaya Vardya said, “Over the past several years we have expended a great deal of time, money and man power to assume a leadership role in the RF microwave market. The development of fusion bonding technology represents another step towards providing our customers with a complete RF microwave solution. Our team here at American Standard Circuits has done a great job in helping us to gain the technological capability to attain our market leadership position.”
As a leader in RF technology, American Standard Circuits has authored the micro eBook “The Printed Circuit Board Designer’s Guide to….Fundamentals of RF/Microwave PCBs". Download it here.