Turn Key Assembly ASC Currently provides turn key assembly to a number of it’s customers. Our capabilities include: Lead-free or tin/lead SMT (Surface Mount Technology) and IMT (Insertion Mount Technology) a.k.a. “through-hole” manufacturing SMT capabilities (lead-free or tin/lead) From as small 01005 and 0201 To fine pitch devices such as uBGA, BGA, CSP, QFN, QFP and large packages). 10-12 mil pitch. BGA X-RAY Different material process capabilities such as Flex Materials, Exotic Materials, Metal Core / Backed Boards, Teflon Various conformal coating (silicon, acrylic, urethane etc.). Flying probe ICT, functional testing, EEPROM programming.

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